Job Description
Reporting directly to the Product Engineering Director within the Operations department you will be working closely with Silicon Design, DFT Engineering and Product Engineering.

Key Responsibilities

·       Support the Development of Test Solution for Wafer Probe and Final Assembly test.

·       Support external vendors with hardware and software design, along with bring-up and site transfer.

·       Support Test Platform selection, assess ATE resources requirements against product specifications.

·       Working with DFT, Silicon Design & Product Engineering to produce Test Plans and requirements documentation.

·       Both Produce & Review Test specifications and provide feedback into Design for future devices.

·       Support Product Engineering with NPI and Volume test life cycle.

·       Support Product Engineering and Operations with test data collection, test coverage improvements, test time reduction and RMA investigations.

Relevant Experience, Skills and Knowledge

·       A minimum of 3 years direct working experience within Semiconductor IC testing.

·       An Electronics related degree or equivalent additional experience.

·       Experience with Digital Testing techniques including BIST, SCAN and JTAG.

·       Test programming experience (Unix, C, C+, IGXL).

·       Familiarity with Teradyne or Advantest ATE platforms would be preferred.

·       Experience with test bench vector generation and test pattern conversion (e.g. WGL, STIL, EVCD) would be an advantage.

·       Effective verbal and written communications skills.

·       Ability to work independently on defined objectives and provide regular feed back to the Product Engineering Director.

·       Ability to Travel to both Vendor or supplier sites in order to support investigation, selection, test development & production support (Europe, ASIA and potentially USA).