Picocom, the 5G open RAN baseband semiconductor and software specialist, is a semiconductor company that designs and markets open RAN standard-compliant baseband SoCs and carrier-grade software products for 5G small cell infrastructure.
The company is privately venture capital-funded with offices in Bristol, UK, and Hangzhou and Beijing, China. Picocom founding members have extensive experience in leading teams in wireless baseband for infrastructure design.
Picocom aims to empower wireless innovation by delivering class-leading 5G small cell technology and products. Picocom:
- is solely focused on 5G NR baseband technology;
- enables mobile operators to diversify their supply chains;
- empowers wireless vendors to compete in 5G NR.
For more information on our technology and products click here.
Picocom is a proud member of the Small Cell Forum (SCF), O-RAN Alliance, techUK and Telecom Infra Project (TIP) industry associations.
Andes Technology Corporation is a world-class creator of innovative high-performance/low-power 32/64-bit processor cores and associated development environment to serve the rapidly growing global embedded system applications. The company delivers superior low power CPU cores, including the comprehensive RISC-V V5 family of processor IPs, with integrated development environment and associated software/hardware solutions for efficient SoC design. Up to the end of 2019, the cumulative volume of Andes-Embedded™ SoCs has surpassed the 5-billion mark. Andes Technology’s comprehensive CPU line includes extensible entry-level, mid-range and high-end families.
For more information, please visit www.andestech.com.
Arteris IP provides network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers. Arteris IP products include the Ncore® cache coherent and FlexNoC® non-coherent interconnect IP, the CodaCache® standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO® automated timing closure capabilities.
CEVA is the leading licensor of wireless connectivity and smart sensing platforms. Our technology portfolio includes a variety of Digital Signal Processors, AI processors, wireless platforms (5G, Bluetooth, Wi-Fi, NB-IoT) and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world. More than 1 billion CEVA-powered devices ship annually.
For more information, visit www.ceva-dsp.com.
At imec.IC-link we help innovators, entrepreneurs and universities realize their prototype and volume ASIC ideas with a complete package of tailored services. Our world-class experts and a global network of trusted partners offer customized support across the entire IC value chain, from imagination to mass production. We are a TSMC value chain aggregator for Europe, North America, Russia, Brazil, India and China.
Imec.IC-link is part of imec, an R&D hub for nano- and digital technologies, with HQ in Leuven, Belgium.
For more information visit www.imec-int.com/en/iclink.
Moortec is the go-to leader for innovative in-chip monitoring technologies and sensing fabrics. The company is dedicated to maximizing performance, optimizing power utilization, and enabling highly accurate in-chip analytics across many sectors, including AI, Data Center, 5G & Consumer and Automotive applications.
For more information, visit www.moortec.com.
Since its founding in 1982, PALTEK’s core business has been selling semiconductors to Japanese telecommunications equipment manufacturers, as well as providing contract design services, and being a consulting partner in customer product development. PALTEK will contribute to our customers’ development by providing optimal solutions based on our corporate philosophy of “kyo-sei” (cooperative growth).
For more information about PALTEK, see www.paltek.co.jp
Radisys is a global leader in open telecom solutions and services. Its disaggregated platforms and integration services leverage open reference architectures and standards combined with open software and hardware, enabling service providers to drive open digital transformation. Radisys offers an end-to-end solutions portfolio from digital end points, to disaggregated and open access and core solutions, to immersive digital applications and engagement platforms. Its world-class and experienced network services organization delivers full lifecycle services to help service providers build and operate highly scalable and high-performance networks at optimum total cost of ownership.
For more information, visit www.radisys.com.
UltraSoC is a pioneering developer of analytics and monitoring technology at the heart of the systems-on-chip (SoCs) that power today’s electronic products. The company’s embedded analytics technology allows product designers to add advanced cybersecurity, functional safety and performance tuning features; and it helps resolve critical issues such as increasing system complexity and ever-decreasing time-to-market. UltraSoC’s technology is delivered as semiconductor IP and software to customers in the avionics and aerospace, automotive, computing and communications industries.
For more information, visit www.ultrasoc.com.