CIE article: The case for optimised silicon in the next generation of cellular networks
5G Open RAN Small Cells will improve security and flexibility and speed up deployment of a new era of network technology
Picocom VP Product Management Vicky Messer is featured with an article contribution in the February 2023 edition of Components in Electronics (CIE).
Her article highlights that future networks must be underpinned with open, flexible, optimised, and interoperable silicon and provisioned by a diverse ecosystem of best-in-class suppliers. And that to compete, challenger Open RAN vendors need access to Open RAN chips they can buy on the open market to compete with the traditional vendors.
With PC802, the industry’s first purpose-designed PHY system-on-chip (SoC) for 5G NR / LTE small cell disaggregated and integrated RAN architectures, Picocom is contributing to the Open RAN movement by enabling new entrants and challenger companies to compete in the Open RAN market.
Please click here to read the full article.